Pimel™ photosensitive polyimide/PBO precursor is a liquid photosensitive material used by semiconductor manufacturers worldwide for buffer coating and packaging applications. The product lineup includes a wide variety of both solvent developable negative tone types and TMAH developable positive tone types that meet a broad range of cutting-edge requirements. Polyimide and polybenzoxazole (PBO) buffer coats made from Pimel™ protect wafer dice from damage with outstanding resistance to heat and chemicals as well as superior electrical and mechanical properties.
- Applications
- Semiconductor buffer coating, passivation layer for single bumping, dielectric layer for re-distribution bumping, photosensitive adhesives
- Contact
- Fab Materials Marketing Dept., Electronics & Functional Products Div.+81-(0)3-6699-3991FAX:+81-(0)3-6699-3923